Todas as vagas
Senior Principal Power Packaging Architect
NXP Semiconductors
Austin +2 · PresencialLiderança (10+ anos)Tempo integralPublicada há 8 dias
Sobre a vaga
O que você vai fazer
Define and deliver advanced package architectures, materials, and assembly processes to support NXP business lines. Lead complex cross-functional technical programs to ensure successful new product and technology introductions.
O que eles procuram
Requires a Bachelor's degree or higher in Engineering or Materials Science and over 10 years of experience in semiconductor packaging. Candidates must possess deep expertise in advanced packaging technologies and strong cross-functional project leadership skills.
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