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Senior Principal Power Packaging Architect
NXP Semiconductors
Austin +2 · On-siteLead (10+ years)Full-timePosted 8 days ago
About the job
What you'll do
Define and deliver advanced package architectures, materials, and assembly processes to support NXP business lines. Lead complex cross-functional technical programs to ensure successful new product and technology introductions.
What they're looking for
Requires a Bachelor's degree or higher in Engineering or Materials Science and over 10 years of experience in semiconductor packaging. Candidates must possess deep expertise in advanced packaging technologies and strong cross-functional project leadership skills.
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