Todas as vagas
Principal Infrastructure Researcher – 3D Integration
ASML
Veldhoven · PresencialLiderança (10+ anos)Tempo integralPublicada há 6 dias
Sobre a vaga
O que você vai fazer
You will define and realize the infrastructure roadmap for advanced hybrid bonding research, including equipment selection and laboratory facility development. Additionally, you will manage external technology partners and coordinate with multidisciplinary teams to ensure experimental validation of future lithography requirements.
O que eles procuram
Candidates must hold a PhD or MSc in a relevant engineering or science field with extensive experience in semiconductor process development and 3D integration. Strong strategic insight, system-thinking, and the ability to lead in ambiguous research environments are essential for this role.
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