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Principal Infrastructure Researcher – 3D Integration
ASML
Veldhoven · On-siteLead (10+ years)Full-timePosted 6 days ago
About the job
What you'll do
You will define and realize the infrastructure roadmap for advanced hybrid bonding research, including equipment selection and laboratory facility development. Additionally, you will manage external technology partners and coordinate with multidisciplinary teams to ensure experimental validation of future lithography requirements.
What they're looking for
Candidates must hold a PhD or MSc in a relevant engineering or science field with extensive experience in semiconductor process development and 3D integration. Strong strategic insight, system-thinking, and the ability to lead in ambiguous research environments are essential for this role.
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