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3D Packaging Engineer
Delft · HíbridoPleno (2–5 anos)Tempo integralPublicada há 14 dias
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O que você vai fazer
The 3D Packaging Engineer will adapt and calibrate high-precision assembly equipment to realize quantum processor products. They will also develop and refine bonding processes for non-standard substrates while executing complex 3D integration strategies.
O que eles procuram
Candidates must hold a degree in Mechanical Engineering, Mechatronics, Physics, Materials Science, or a related field. They should have 3–5 years of hands-on experience with high-accuracy semiconductor assembly platforms and 3D integration knowledge.
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