About the job
What you'll do
The 3D Packaging Engineer will adapt and calibrate high-precision assembly equipment to realize quantum processor products. They will also develop and refine bonding processes for non-standard substrates while executing complex 3D integration strategies.
What they're looking for
Candidates must hold a degree in Mechanical Engineering, Mechatronics, Physics, Materials Science, or a related field. They should have 3–5 years of hands-on experience with high-accuracy semiconductor assembly platforms and 3D integration knowledge.
Full description