Signal and Power Integrity Engineer
About the job
What you'll do
Lead signal and power integrity analysis and optimization for high-performance computing designs using advanced packaging technologies, from early product definition through package design closure. Collaborate with chip, system, validation, and vendor teams to evaluate high-speed interfaces, develop memory interfaces, improve simulation methodologies, and support post-silicon validation and qualification.
What they're looking for
Candidates need a bachelor's degree in a relevant engineering or computer science field, or equivalent practical experience, and at least eight years of SI/PI design experience for chip/package or system PCB. They should have experience with SI/PI modeling tools, high-speed memory and SerDes lab characterization, cross-functional design and validation work, and automation using Python, MATLAB, or C++; advanced degrees and expertise in chiplet and 3D packaging are advantageous.