About the job
What you'll do
Lead the development of back-end fabrication and assembly technologies for quantum processors, focusing on flip chip bonding and chip stack architecture. Define process development projects and coordinate integration test plans to ensure scalable and optimized technical components.
What they're looking for
Requires 4+ years of experience in chip assembly for deep-tech or low-volume technology, specifically with flip-chip and back-end process flows. A background in physics or engineering is required, with a PhD and experience in superconducting qubits being significant advantages.
Full description